Saitama, Japan

Akihiro Koga

This inventor holds 1 USPTO granted patent. Top assignee: Sony Corporation. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Akihiro Koga. Retrieved from https://idiyas.com/inventor/akihiro-koga-5jw255kk

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 17.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Akihiro Koga: Innovator in Electronics Packaging

Introduction

Akihiro Koga is a notable inventor based in Saitama, Japan. He has made significant contributions to the field of electronics packaging, particularly through his innovative patent that enhances the efficiency of electronic device mounting systems.

Latest Patents

Koga holds a patent for a "System for mounting electronic device." This electronics packaging system includes a printer, a placing unit, and a reflow unit. The system allows a printed wiring board to be carried in an upright position while having solder printed on all lands simultaneously. This design enables electronic parts to be placed and soldered to the lands at the same time, resulting in a more compact system and a reduction in packaging time.

Career Highlights

Akihiro Koga is currently employed at Sony Corporation, where he continues to innovate in the electronics sector. His work has been instrumental in advancing the technology used in electronic device manufacturing.

Collaborations

Koga has collaborated with notable colleagues, including Mitsuo Inoue and Toshio Toyama, contributing to various projects within the company.

Conclusion

Akihiro Koga's contributions to electronics packaging through his innovative patent demonstrate his commitment to improving efficiency in the industry. His work at Sony Corporation continues to influence the future of electronic device manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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