Akihiro Hidaka

Title: Innovations by Akihiro Hidaka: Advancements in Connector Structures

Introduction

Akihiro Hidaka, inventor based in Yamaguchi-ken, Japan, has made significant contributions to the field of electronic packaging. His creativity and ingenuity are exemplified by his patent that focuses on enhancing the efficiency of ball-grid arrays in electronic devices.

Latest Patents

Hidaka holds a notable patent entitled "Method of forming connector structure for a ball-grid array." This innovation addresses the need to increase packaging density in electronic packages by reducing ball pitch. The patent describes a ball-grid array connector structure utilizing a plastic substrate with at least one hollow through-hole and electrodes lining the walls of the through-hole. These electrodes form pads on each surface of the substrate, enabling the attachment of metallic balls, which can be secured directly or via soldering techniques.

Career Highlights

With a focus on electronic materials and connector technologies, Akihiro Hidaka has dedicated his career to improving electronic packaging methodologies. His work not only innovates technical performance but also responds to the industry's demand for more compact and efficient designs. The unique aspects of his patent demonstrate a blend of practical application and inventive thought.

Collaborations

Throughout his career, Hidaka has collaborated with talented individuals such as Toshihiko Kubo and Takuji Ito. These partnerships have fostered a creative environment that encourages problem-solving and innovative thinking in the realm of electronic packaging.

Conclusion

Akihiro Hidaka's contributions through his patent signify an important step in advancing the technology of ball-grid arrays. His developments not only enhance the functionality of electronic packages but also illustrate the vital role of inventors in shaping the future of technology. Innovators like Hidaka inspire continued progress in engineering and technological design.