Other

Akihiro Hidaka

Toshihiko Kubo

Hiroshi Takamichi

Takuji Ito

A ball-grid array connector structure for an electronic package in which the ball pitch can be reduced to increase the packaging density has a plastic substrate having at least one hollow through-hole and an electrode covering the wall of the through-hole and forming an electrode pad surrounding the through-hole on each surface of the substrate. A metallic ball is joined, either directly or through a solder or a combination of a metallic bump and a solder, to the electrode pad on at least one surface of the substrate at the position of the through-hole. The connector structure can be formed either by sealing an open end of the through-hole on the side to which the ball is not joined, or increasing the pressure within the through-hole by a pressure-control mechanism, before the through-hole is blocked by reflowing the ball itself or the metallic bump or solder used to connect the ball.

Growing community of inventors

Yamaguchi-ken, Japan

Akihiro Hidaka