Akihiko Murasumi

Title: Akihiko Murasumi: Innovator in Electroless Palladium Plating

Introduction

Akihiko Murasumi is a notable inventor based in Hirakata, Japan. He has made significant contributions to the field of plating technology, particularly through his innovative patent related to electroless palladium plating.

Latest Patents

Murasumi holds a patent for an "Electroless palladium plating bath and electroless palladium plating method." This invention discloses a plating bath that contains a palladium compound, complexing agents such as ammonia and amine compounds, reducing agents like phosphinic acid and phosphinates, and unsaturated carboxylic acid compounds. The electroless palladium plating bath boasts high stability, minimizing decomposition and extending bath life compared to conventional options. Additionally, it provides excellent solder bonding and wire bonding characteristics, maintaining plating film quality over extended use. He has 1 patent to his name.

Career Highlights

Murasumi is associated with C. Uyemura Co., Ltd., where he has been instrumental in advancing plating technologies. His work has contributed to the company's reputation for innovation in the field.

Collaborations

Murasumi has collaborated with notable colleagues, including Hiromu Inagawa and Seigo Kurosaka, to further enhance the development of plating methods and technologies.

Conclusion

Akihiko Murasumi's contributions to electroless palladium plating represent a significant advancement in the field, showcasing his innovative spirit and dedication to improving plating technologies. His work continues to influence the industry positively.