Ai-Hwa Lim

Title: Innovations by Ai-Hwa Lim in Multi-Layer Circuit Board Manufacturing

Introduction

Ai-Hwa Lim is a notable inventor based in Taipei, Taiwan. She has made significant contributions to the field of electronics, particularly in the manufacturing of multi-layer circuit boards. Her innovative approach has led to the development of a unique manufacturing method that enhances the efficiency and effectiveness of circuit board production.

Latest Patents

Ai-Hwa Lim holds a patent for a manufacturing method for a multi-layer circuit board. This method includes several steps that begin with compressing two core layers to form a substrate with two opposite surfaces. A via connecting these surfaces is then created, followed by the formation of a patterned circuit layer featuring a concentric-circle pattern. The process continues with the creation of stacking layers and through holes that align with the concentric-circle pattern, ultimately resulting in a highly functional multi-layer circuit board.

Career Highlights

Ai-Hwa Lim is currently employed at Unimicron Technology Corporation, where she applies her expertise in circuit board manufacturing. Her work has been instrumental in advancing the company's technological capabilities and product offerings. With her innovative mindset, she continues to push the boundaries of what is possible in the electronics industry.

Collaborations

Throughout her career, Ai-Hwa Lim has collaborated with talented individuals such as Pei-Chang Huang and Cheng-Po Yu. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Ai-Hwa Lim's contributions to the field of multi-layer circuit board manufacturing exemplify her innovative spirit and dedication to advancing technology. Her patent and work at Unimicron Technology Corporation highlight her role as a key player in the electronics industry.