Adam Wade Schubring

Title: The Innovative Contributions of Adam Wade Schubring

Introduction

Adam Wade Schubring is a notable inventor based in Kokomo, Indiana. He has made significant contributions to the field of electronics through his innovative patent. His work focuses on improving manufacturing processes for multi-layer thick film circuits, which are essential in modern electronic devices.

Latest Patents

Adam Wade Schubring holds a patent for a "Method of manufacture for a thick film multi-layer circuit." This invention presents an improved method of manufacturing multi-layer thick film circuits that effectively eliminates the trade-off between thickness and definition. It allows for dielectric layers of increased thickness without pin-holes while achieving more precise definitions of dielectric features, such as via openings and solder stops. The process involves an initial thin layer of dielectric material, known as a feature definition print (FDP), which is crucial for defining dielectric features accurately.

Career Highlights

Schubring's career is marked by his role at Delco Electronics Corporation, where he has applied his expertise in electronics manufacturing. His innovative approach has led to advancements in the production of thick film circuits, enhancing the performance and reliability of electronic components.

Collaborations

Throughout his career, Adam has collaborated with notable colleagues, including Frans Peter Lautzenhiser and John Karl Isenberg. These collaborations have contributed to the development and refinement of his innovative manufacturing methods.

Conclusion

Adam Wade Schubring's contributions to the field of electronics through his patent for manufacturing thick film multi-layer circuits demonstrate his commitment to innovation. His work not only improves manufacturing processes but also enhances the performance of electronic devices.