Adam Herrmann

Title: Innovations of Adam Herrmann

Introduction

Adam Herrmann is an accomplished inventor based in Piqua, Ohio. He has made significant contributions to the field of additive manufacturing, particularly in the development of magnetic materials. With a total of 2 patents to his name, Herrmann's work is paving the way for advancements in various applications.

Latest Patents

Herrmann's latest patents focus on magnetic elements and methods for their additive manufacture. These patents detail the creation of elements formed from magnetic materials, including magnetic alloy materials such as Fe-Co alloys. The patents describe how these materials can be utilized in additive manufacturing techniques, including direct energy deposition and laser powder bed fusion. The manufacturing processes involve controlling deposition time and energy to manipulate the magnetic and structural properties of the materials. Additionally, post-deposition processing techniques, such as machining and heat treating, are discussed to enhance the material's performance. The magnetic elements produced can be used in various applications, including motors, generators, solenoids, sensors, transformers, and hall thrusters.

Career Highlights

Adam Herrmann is associated with the California Institute of Technology, where he continues to innovate and contribute to the field of engineering. His expertise in magnetic materials and additive manufacturing has positioned him as a key figure in his area of research.

Collaborations

Throughout his career, Herrmann has collaborated with notable colleagues, including Samad A Firdosy and Robert Peter Dillon. These collaborations have further enriched his research and development efforts.

Conclusion

Adam Herrmann's contributions to the field of magnetic materials and additive manufacturing are noteworthy. His innovative patents and collaborations reflect his commitment to advancing technology in this domain. His work continues to inspire future developments in engineering and manufacturing.