Beavercreek, OR, United States of America

Adam Birge

This inventor holds 1 USPTO granted patent. Top assignee: Biotronik Se Co. Kg. Active years: 2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Adam Birge. Retrieved from https://idiyas.com/inventor/adam-birge

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: Adam Birge - Innovator in Semiconductor Packaging

Introduction

Adam Birge is a notable inventor based in Beavercreek, Oregon. He has made significant contributions to the field of semiconductor packaging, showcasing his innovative spirit and technical expertise.

Latest Patents

Adam holds a patent for a semiconductor package. This invention includes a carrier with a top surface and a bottom surface, separated by side walls. The carrier features a seat for a component and at least one terminal region for electrically connecting the component to the carrier when mounted. Additionally, a test portal is arranged at an outer surface of the carrier, with routing paths designed for routing electrical contacts to the test portal.

Career Highlights

Adam is currently employed at Biotronik SE & Co. KG, where he continues to develop cutting-edge technologies in the semiconductor industry. His work has been instrumental in advancing the efficiency and functionality of semiconductor packages.

Collaborations

Some of Adam's coworkers include Kevin Pickup and Anthony A Primavera, who contribute to the innovative environment at Biotronik.

Conclusion

Adam Birge's contributions to semiconductor packaging reflect his dedication to innovation and technology. His patent and ongoing work at Biotronik highlight his role as a key player in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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