The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2015

Filed:

May. 29, 2012
Applicants:

Adam Birge, Beavercreek, OR (US);

Kevin Pickup, Portland, OR (US);

Anthony A. Primavera, Newberg, OR (US);

Inventors:

Adam Birge, Beavercreek, OR (US);

Kevin Pickup, Portland, OR (US);

Anthony A. Primavera, Newberg, OR (US);

Assignee:

Biotronik SE & Co. KG, Berlin, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/13 (2013.01); H01L 23/49805 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 25/0657 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/49175 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06562 (2013.01); H01L 2924/15156 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15312 (2013.01); H01L 2924/15313 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/06596 (2013.01);
Abstract

A semiconductor package and a carrier for a semiconductor package are provided, the carrier having a top surface and a bottom surface separated by side walls. The carrier includes a seat for a component, and at least one terminal region for electrically connecting the component to the carrier when mounted to the seat, wherein a test portal is arranged at an outer surface of the carrier, and wherein one or more routing paths are arranged in the carrier for routing one or more electrical contacts arranged at the carrier to the test portal.


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