San Diego, CA, United States of America

Abhishek Jain

This inventor holds 2 USPTO granted patents and 14 published patent applications. Top assignees: Qualcomm Incorporated, Qualcomm Incorproated. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Abhishek Jain. Retrieved from https://idiyas.com/inventor/abhishek-jain-kq7xtw8j

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: Abhishek Jain: Innovator in Die Interconnect Structures

Introduction

Abhishek Jain is a notable inventor based in San Diego, CA. He has made significant contributions to the field of semiconductor technology, particularly in die interconnect structures. With a total of 2 patents, Jain's work focuses on enhancing the performance of electronic components.

Latest Patents

One of Jain's latest patents is titled "Die interconnect structure with embedded inductor(s) including coupled coils formed in redistribution layer (RDL) and adjacent bump-level distribution layer (BDL) for improved Q factor." This invention describes a die interconnect structure that incorporates embedded inductors with coupled coils, which are designed to improve the Q factor. The structure includes a metal pad, a first coil in the RDL, and a secondary metal pad with a second coil in the BDL. The inclusion of a seed layer between the coils enhances the overall conductance and reduces resistance, leading to better performance.

Another significant patent is "Recessed through-die vertical interconnect accesses to back-side power distribution networks and related methods." This patent further showcases Jain's innovative approach to improving interconnect technologies in semiconductor devices.

Career Highlights

Abhishek Jain has worked with prominent companies in the tech industry, including Qualcomm Incorporated. His experience at Qualcomm has allowed him to develop and refine his expertise in semiconductor technologies and interconnect structures.

Collaborations

Throughout his career, Jain has collaborated with talented professionals such as Junjing Bao and John Jianhong Zhu. These collaborations have contributed to the advancement of his research and innovations in the field.

Conclusion

Abhishek Jain is a distinguished inventor whose work in die interconnect structures has the potential to significantly impact the semiconductor industry. His innovative patents reflect his commitment to enhancing electronic component performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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