Aaron Lee

Title: Aaron Lee and His Contributions to RF Module Shielding.

Introduction

Aaron Lee is an inventor based in Seoul, South Korea. His patent work includes techniques for reducing electromagnetic interference in radio-frequency modules and electronic packages. His portfolio includes 3 patents.

Latest Patents

One of Lee’s latest patents, “Systems and Methods for Providing Electromagnetic Interference (EMI) Shielding Between Inductors of a Radio Frequency (RF) Module,” describes a wire-based shield designed to reduce electromagnetic crosstalk between inductors while preserving their high quality factors. The shield uses spaced conductive wires positioned over and around an inductor, with both ends of each wire connected to an electrical ground structure. The wires are kept apart from the inductor, and their spacing is selected to attenuate frequencies of interest.

Another patent, “Systems and Methods for Providing Electromagnetic Interference (EMI) Compartment Shielding for Components Disposed Inside of System Electronic Packages,” presents a similar wire-based approach for shielding circuitry within a system module package. Conductive wires surround and extend over the circuitry, with their spacing chosen to attenuate targeted frequencies. Each wire is grounded at both ends and remains separated from the components it shields.

Career Highlights

Lee’s listed professional affiliations include Avago Technologies General IP (Singapore) Pte. Ltd. and Avago Technologies International Sales Pte. Limited. His patent work reflects a focus on practical EMI shielding structures for compact electronic systems.

Collaborations

Lee’s listed coworkers include Deog-Soon Choi and Lueder Elbrecht. Their shared professional context connects them to work in the electronics and patent fields.

Conclusion

Aaron Lee’s inventions address electromagnetic interference in RF modules and electronic packages through grounded, spaced conductive-wire shields designed to protect circuitry without contacting the components.