Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies International Sales Pte. Limited

Aaron Lee

Deog-Soon Choi

Lueder Elbrecht

Li Sun

Bernhard Gebauer

Sarah Kay Haney

Nitesh Kumbhat

Chang-Yul Cheon

Jack Ajoian

Sang-Hwa Jung

Hyun-Mo Ku

Sung-Phyo Lim

Oliver Wiedenmann

Electrically-conductive wires are used to construct an EMI shield between inductors of an RF module that prevents, or at least reduces, EMI crosstalk between the inductors while maintaining high Q factors for the inductors. The EMI shield comprises at least a first set of electrically-conductive wires that at least partially surrounds and extends over at least a first inductor of a pair of inductors. Adjacent wires of the first set are spaced apart from one another by a predetermined distance selected to ensure that the EMI shield attenuates a frequency or frequency range of interest. First and second ends of each of the wires are connected to an electrical ground structure. A length of each wire in between the first and second ends of the respective wire extends above the first inductor and is spaced apart from the first inductor so as not to be in contact with the first inductor.

Systems and methods for providing electromagnetic interference (EMI) shielding between inductors of a radio frequency (RF) module

A compartment EMI shield for use inside of a system module package is provided that comprises at least a first set of electrically-conductive wires that surrounds and extends over circuitry of the module package. Adjacent wires of the first set are spaced apart from one another by a predetermined distance selected to ensure that the compartment EMI shield attenuates a frequency or frequency range of interest. First and second ends of each of the wires are connected to an electrical ground structure. A length of each wire that is located in between the first and second ends of the respective wire extends above the circuitry and is spaced apart from the components of the circuitry so as not to be in contact with the components of the circuitry.

Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packages

A process for forming an encapsulating mold compound into a molded solder mask on a bottom surface of a PCB is provided that allows the molded solder mask to have a very precise, preselected thickness, or height, while also ensuring that no gaps between the solder mask and side walls of the electrical contact pads exist. A circuit board and circuit board assembly that incorporate the molded solder mask are also provided. The molded solder mask is fabricated in such a way that overlap between the molded solder mask and the electrical contact pads and gaps between the molded solder mask and the side walls of the electrical contact pads are avoided. In addition, the molded solder mask allows the pitch between adjacent electrical contact pads to be greatly reduced compared to the pitch that is possible using a traditional solder mask formed by the traditional photolithographic approach.

Printed circuit board (PCB) and PCB assembly having an encapsulating mold material on a bottom surface thereof and methods for molding an encapsulating mold material on a bottom surface of a PCB

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Seoul, South Korea

Aaron Lee