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For the Inventor, By the Inventor

Calamba, Philippines

Aaron Cadag

USPTO Granted Patents = 17 

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 26(Granted Patents)


Company Filing History:

goldMedal17 out of 2,870 
 
Stmicroelectronics Gmbh
 patents

Years Active: 2015-2025

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17 patents (USPTO):Explore Patents
1. 12255076 - Method for manufacturing leadless semiconductor package with wettable flanks (2025-03-18),
2. 12211774 - Lead stabilization in semiconductor packages (2025-01-28),
3. 11929259 - Method for manufacturing leadless semiconductor package with wettable flanks (2024-03-12),
4. 11916090 - Tapeless leadframe package with exposed integrated circuit die (2024-02-27),
5. 11557548 - Package with interlocking leads and manufacturing the same (2023-01-17),
6. 11355423 - Bottom package exposed die MEMS pressure sensor integrated circuit package design (2022-06-07),
7. 11069601 - Leadless semiconductor package with wettable flanks (2021-07-20),
8. 10910295 - QFN pre-molded leadframe having a solder wettable sidewall on each lead (2021-02-02),
9. 10903172 - Package with interlocking leads and manufacturing the same (2021-01-26),
10. 10541196 - QFN pre-molded leadframe having a solder wettable sidewall on each lead (2020-01-21),
11. 10529672 - Package with interlocking leads and manufacturing the same (2020-01-07),
12. 10483191 - Bottom package exposed die MEMS pressure sensor integrated circuit package design (2019-11-19),
13. 10461019 - Package with backside protective layer during molding to prevent mold flashing failure (2019-10-29),
14. 10128169 - Package with backside protective layer during molding to prevent mold flashing failure (2018-11-13),
15. 10079198 - QFN pre-molded leadframe having a solder wettable sidewall on each lead (2018-09-18),

Title: The Innovative Contributions of Aaron Cadag

Introduction

Aaron Cadag is a prominent inventor based in Calamba, Philippines, known for his significant contributions to the field of semiconductor technology. With a total of 17 patents to his name, Cadag has made remarkable advancements that enhance the functionality and reliability of semiconductor packages.

Latest Patents

Among his latest patents is a method for manufacturing leadless semiconductor packages with wettable flanks. This innovation focuses on improving the solder fillet formation when the leadless semiconductor package is mounted to a substrate. The design ensures that solder fillets are consistently formed and easily detectable by inspection systems, such as automated optical inspection (AOI) systems. Another notable patent addresses lead stabilization in semiconductor packages. This invention describes semiconductor packages that comprise a plurality of leads, including active leads that are electrically coupled to bond pads of a semiconductor die, and inactive leads that are not electrically coupled. The active leads are designed to form lands at the lower surface of the package, enhancing the overall performance of the semiconductor device.

Career Highlights

Aaron Cadag is currently employed at STMicroelectronics GmbH, where he continues to innovate and develop cutting-edge semiconductor technologies. His work has significantly impacted the industry, leading to improved manufacturing processes and product reliability.

Collaborations

Some of his notable coworkers include Ela Mia Cadag and Ernesto Antilano, Jr. Their collaborative efforts contribute to the dynamic environment at STMicroelectronics, fostering innovation and excellence in semiconductor design.

Conclusion

Aaron Cadag's contributions to semiconductor technology through his patents and work at STMicroelectronics GmbH highlight his role as a key innovator in the field. His inventions not only advance technology but also pave the way for future developments in the industry.

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