Forward Citations = 150

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9 inventors (with patents filed for the assignee):

Hua Zheng (4 out of 61 patents)

Loc Bao Hoang (2 out of 42 patents)

Tung-Yi Chan (1 out of 9 patents)

4. Hui Zhao (1 out of 4 patents)

5. Dah-Bin Kao (1 out of 11 patents)

6. Albert T Wu (1 out of 4 patents)

7. Yuan-Mou Su (1 out of 3 patents)

8. Hasan Gadjali (1 out of 1 patent)

9. Peter H Hsieh (1 out of 2 patents)

7 patents: Sort by Forward Citations

1. 7061941 - Data input and output circuits for multi-data rate operation (2006-06-13),

2. 6323089 - Semiconductor memory array with buried drain lines and processing methods therefor (2001-11-27),

3. 6122219 - Split array semiconductor graphics memory architecture supporting (2000-09-19),

4. 6061291 - Memory integrated circuit supporting maskable block write operation and (2000-05-09),

5. 6046948 - Low word line to bit line short circuit standby current semiconductor (2000-04-04),

6. 6026021 - Semiconductor memory array partitioned into memory blocks and sub-blocks (2000-02-15),

7. 5995150 - Dual compressed video bitstream camera for universal serial bus (1999-11-30),

Company Overview

Winbond Electronics Corporation America is a leading supplier of semiconductor solutions for the consumer, computer, communications and automotive markets. With a focus on innovation and quality, the company offers a wide range of products including DRAM, flash memory, and mixed-signal devices. Founded in 1987, Winbond is headquartered in Taiwan with a presence in the United States and other key markets around the world.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

7 Patents

#647 in San Jose, CA

#9,491 in California

#39,879 in US

San Jose, CA, United States of America

Winbond Electronics Corporation America

Forward Citations = 150

9 inventors:

Hua Zheng (4 out of 61 patents)

Loc Bao Hoang (2 out of 42 patents)

Tung-Yi Chan (1 out of 9 patents)

4. Hui Zhao (1 out of 4 patents)

5. Dah-Bin Kao (1 out of 11 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Winbond Electronics Corporation America. Retrieved from https://idiyas.com/company/winbond-electronics-america

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]