Forward Citations = 16

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3 inventors (with patents filed for the assignee):

Kai-Chiang Wu (2 out of 174 patents)

Yi-Liang Peng (2 out of 2 patents)

Ya-Yun Cheng (1 out of 27 patents)

2 patents: Sort by Forward Citations

1. 6633086 - Stacked chip scale package structure (2003-10-14),

2. 6570263 - Structure of plated wire of fiducial marks for die-dicing package (2003-05-27),

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

2 Patents

#562 in Hsinchu

#4,250 in Taiwan

Hsinchu, Taiwan

Vate Technology Co., Ltd.

Forward Citations = 16

3 inventors:

Kai-Chiang Wu (2 out of 174 patents)

Yi-Liang Peng (2 out of 2 patents)

Ya-Yun Cheng (1 out of 27 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Vate Technology Co., Ltd.. Retrieved from https://idiyas.com/company/vate-technology-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]