The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2003
Filed:
Jun. 06, 2002
Vate Technology Co., Ltd., Hsinchu, TW;
Abstract
The present invention provides a design structure of an plated wire of a fiducial mark for a die-dicing package. In the present structure, a cutting line is positioned between each two adjacent ball grid array (BGA) chips. There is configured a solder mask opening at the edge connecting region of the cutting lines. A fiducial mark is positioned in the opening of each BGA chip, wherein the fiducial mark is close to the cutting line and positioned a plated wire therein to pull from the fiducial mark to out the opening and to connect to the plated wire of the cutting line. So as all the plated wires utilizing the coverage of the solder mask can be entirely cut without the pulling problem from the cutter. The present invention provides a new design structure of the plated wire to overcome the burr effect of prior die dicing so as to enhance the product efficiency and decrease the manufacturing cost.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile