Richmond, VA, United States of America

Temperpack Technologies, Inc.


USPTO Granted Patents = 20

Trademarks = 7

Forward Citations = 120

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19 inventors (with patents filed for the assignee):

goldMedal James McGoff (16 out of 16 patents)

silverMedal Charles-Alexandre Vincent (8 out of 8 patents)

bronzeMedal Brian Powers (5 out of 5 patents)

4.  Justin Turner-Gonzalez (4 out of 4 patents)

5.  Charles-Alexandre Archambault Vincent (4 out of 4 patents)

6.  Charles Vincent (3 out of 3 patents)

7.  Alex Dimen (3 out of 3 patents)

8.  Darrell Jobe (2 out of 25 patents)

9.  Daniel Shores (2 out of 2 patents)

10.  Caleb Meindertsma (2 out of 2 patents)

11.  Charles Vincent (2 out of 2 patents)

12.  James Mcgoff (2 out of 5 patents)

13.  Amanda Padilla (1 out of 1 patent)

14.  Richard William Hill, Iii (1 out of 1 patent)

15.  Stefan Marchetti (1 out of 1 patent)


20 patents:

Company Overview
TemperPack Technologies, Inc. is a leader in sustainable packaging solutions, specializing in the development and manufacturing of eco-friendly thermal packaging products. Based in Richmond, VA, the company focuses on innovative materials that provide effective temperature control for shipping perishable goods. Their technology emphasizes reducing environmental impact while maintaining high performance standards, catering to industries such as food and pharmaceuticals. TemperPack is committed to advancing sustainable practices within the packaging sector.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 20 2026

20 Patents

#32 in Richmond, VA

#274 in Virginia

#16,409 in US

#31,295 in the World

Richmond, VA (US)
Richmond, VA, United States of America
Forward Citations = 120

19 inventors:

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Temperpack Technologies, Inc.. Retrieved from https://idiyas.com/company/temperpack-technologies

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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