The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Dec. 14, 2022
Temperpack Technologies Inc., Richmond, VA (US);
James Mcgoff, Richmond, VA (US);
TemperPack Technologies Inc., Richmond, VA (US);
Abstract
Briefly described, embodiments of the presently disclosed subject matter relate to void fill packaging products and one or more methods for making the void fill packaging products. The void fill packaging product is configured to cushion items for transport whether that be shipping long distances, local delivery, or self-transport in a vehicle. Specifically, in one aspect, a void fill product for packaging, may include a single spiraled continuous paper sheet surrounding a hollow center and forming at least two layers that overlap in a first direction. The portions of the at least two layers may overlap and may be mechanically joined in a second direction that is approximately perpendicular to the first direction.