Columbus, OH, United States of America

Sig Combibloc Gmbh


USPTO Granted Patents = 24

% Expired Patents = 16.7

Trademarks = 3

Forward Citations = 220

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28 inventors (with patents filed for the assignee):

goldMedal Arthur W Robichaud (8 out of 19 patents)

silverMedal Michael G Tokarski (6 out of 9 patents)

bronzeMedal Steven G Taylor (5 out of 5 patents)

4.  Hans Weiteder (3 out of 3 patents)

5.  Holger Schmidt (2 out of 8 patents)

6.  Warren C Tyler (2 out of 2 patents)

7.  Melvin L Druin (2 out of 2 patents)

8.  Hans Bomer (2 out of 3 patents)

9.  Jorg Berger (2 out of 4 patents)

10.  C Daniel Miller (2 out of 7 patents)

11.  Hans-Willi Mainz (1 out of 11 patents)

12.  Matthias Dammers (1 out of 23 patents)

13.  Hartmut Kanngiesser (1 out of 8 patents)

14.  Franz-Willi Spelten (1 out of 6 patents)

15.  Thomas Böhme (1 out of 2 patents)


24 patents:

Company Overview
Sig Combibloc GmbH specializes in the development and manufacturing of innovative packaging solutions, particularly for the food and beverage industry. The company is recognized for its advanced aseptic and non-aseptic carton packaging systems, which enhance product safety and shelf life. With a strong emphasis on sustainability, Sig Combibloc focuses on creating environmentally friendly packaging options. The organization operates globally, serving a diverse range of clients and contributing to advancements in packaging technology.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 13 2026

24 Patents

#32 in Columbus, OH

#615 in Ohio

#13,884 in US

#26,660 in the World

Columbus, OH (US)
Columbus, OH, United States of America
Forward Citations = 220

28 inventors:

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Sig Combibloc Gmbh. Retrieved from https://idiyas.com/company/sig-combibloc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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