For the Inventor, By the Inventor

Enter assignee name

Durham, NC, United States of America

Nextreme Thermal Solutions, Inc.

USPTO Granted Patents = 14

% Expired Patents = 21.4

EPO Patents = 4

Forward Citations = 256

Loading Chart...

Loading Chart...

23 inventors (with patents filed for the assignee):

Rama Venkatasubramanian (8 out of 28 patents)

Edward P Siivola (6 out of 8 patents)

Randall G Alley (6 out of 7 patents)

4. Brooks O'Quinn (4 out of 5 patents)

5. David Alan Koester (4 out of 15 patents)

6. Philip A Deane (3 out of 11 patents)

7. Pratima V Addepalli (3 out of 13 patents)

8. Thomas Colpitts (3 out of 4 patents)

9. Robert P Vaudo (2 out of 33 patents)

10. Thomas Peter Schneider (2 out of 2 patents)

11. Kip D Coonley (2 out of 3 patents)

12. Ramaswamy Mahadevan (1 out of 23 patents)

13. Jesko Von Windheim (1 out of 3 patents)

14. Jayesh Bharathan (1 out of 15 patents)

15. Christopher D Holzworth (1 out of 1 patent)

14 patents: Sort by Forward Citations

1. 9190592 - Thin film thermoelectric devices having favorable crystal tilt (2015-11-17),

2. 8623687 - Methods of forming thermoelectric devices including conductive posts and/or different solder materials and related methods and structures (2014-01-07),

3. 8525016 - Thermoelectric devices including thermoelectric elements having off-set metal pads and related structures, methods, and systems (2013-09-03),

4. 8063298 - Methods of forming embedded thermoelectric coolers with adjacent thermally conductive fields (2011-11-22),

5. 7855397 - Electronic assemblies providing active side heat pumping (2010-12-21),

6. 7838760 - Trans-thermoelectric device (2010-11-23),

7. 7838759 - Methods of forming thermoelectric devices including electrically insulating matrices between conductive traces (2010-11-23),

8. RE41801 - Thin-film thermoelectric device and fabrication method of same (2010-10-04),

9. 7804019 - Methods of depositing epitaxial thermoelectric films having reduced crack and/or surface defect densities and related devices (2010-09-28),

10. 7679203 - Methods of forming thermoelectric devices using islands of thermoelectric material and related structures (2010-03-16),

11. 7638705 - Thermoelectric generators for solar conversion and related systems and methods (2009-12-29),

12. 7523617 - Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics (2009-04-28),

13. 7342169 - Phonon-blocking, electron-transmitting low-dimensional structures (2008-03-11),

14. 7235735 - Thermoelectric devices utilizing double-sided Peltier junctions and methods of making the devices (2007-06-26),

Company Overview

Nextreme Thermal Solutions, Inc. is a technology company based in Durham, NC, specializing in advanced thermal management solutions. The organization focuses on the development and manufacturing of innovative thermoelectric devices and materials, which are utilized in various applications including electronics cooling, energy harvesting, and temperature control systems. Nextreme's expertise lies in enhancing thermal performance and energy efficiency across multiple industries, contributing to sustainable technology advancements.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

14 Patents

#56 in Durham, NC

#489 in North Carolina

#22,319 in US

#42,249 in the World

Durham, NC, United States of America

Nextreme Thermal Solutions, Inc.

Forward Citations = 256

23 inventors:

Rama Venkatasubramanian (8 out of 28 patents)

Edward P Siivola (6 out of 8 patents)

Randall G Alley (6 out of 7 patents)

4. Brooks O'Quinn (4 out of 5 patents)

5. David Alan Koester (4 out of 15 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Nextreme Thermal Solutions, Inc.. Retrieved from https://idiyas.com/company/nextreme-thermal-solutions

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

Loading…