% Expired Patents = 23.1

Forward Citations = 51

Loading Chart...

8 inventors (with patents filed for the assignee):

Lu-Chen Hwan (12 out of 14 patents)

P C Chen (3 out of 3 patents)

Yu-Lin Ma (3 out of 3 patents)

4. Po Ching Chen (2 out of 2 patents)

5. Pi Sung Su (1 out of 1 patent)

6. Hsin Cheng Pao (1 out of 1 patent)

7. Yun-Da Jung (1 out of 1 patent)

8. Chi Chun Hsieh (1 out of 1 patent)

13 patents: Sort by Forward Citations

1. 11225113 - Unique ID electronic tag for tire (2022-01-18),

2. 9136585 - Radio frequency identification tag (2015-09-15),

3. 8344734 - Test module for radio frequency identification chips and method of the same (2013-01-01),

4. 8344500 - Integrated circuit package module and method of the same (2013-01-01),

5. 7999191 - Method for making cable with a conductive bump array, and method for connecting the cable to a task object (2011-08-16),

6. 7943426 - Package structure for integrated circuit device and method of the same (2011-05-17),

7. 7886421 - Method for manufacturing integrated circuit device having antenna conductors (2011-02-15),

8. 7772698 - Package structure for integrated circuit device (2010-08-10),

9. 7698805 - Method for manufacturing integrated circuit device having antenna conductors (2010-04-20),

10. 7459345 - Packaging method for an electronic element (2008-12-02),

11. 7413670 - Method for forming wiring on a substrate (2008-08-19),

12. 7312142 - Method for making cable with a conductive bump array, and method for connecting the cable to a task object (2007-12-25),

13. 7273768 - Wafer-level package and IC module assembly method for the wafer-level package (2007-09-25),

Company Overview

Mutual-Pak Technology Co., Ltd. is a prominent player in the packaging industry, specializing in the development and manufacturing of innovative packaging solutions. The company focuses on creating high-quality, sustainable packaging products that cater to a variety of sectors, including food, pharmaceuticals, and consumer goods. With a strong emphasis on research and technology, Mutual-Pak is dedicated to advancing packaging methodologies and materials, ensuring that they meet the evolving needs of their clients while promoting environmental responsibility.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

13 Patents

#118 in Taoyuan

#1,169 in Taiwan

#45,081 in the World

Taoyuan, Taiwan

Mutual-Pak Technology Co., Ltd.

Forward Citations = 51

8 inventors:

Lu-Chen Hwan (12 out of 14 patents)

P C Chen (3 out of 3 patents)

Yu-Lin Ma (3 out of 3 patents)

4. Po Ching Chen (2 out of 2 patents)

5. Pi Sung Su (1 out of 1 patent)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Mutual-Pak Technology Co., Ltd.. Retrieved from https://idiyas.com/company/mutual-pak-technology-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]