The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2007
Filed:
Aug. 30, 2005
Applicant:
Lu-chen Hwan, Taipei, TW;
Inventor:
Lu-Chen Hwan, Taipei, TW;
Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 21/58 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wafer-level package and an IC module assembly method for a wafer-level package are provided in the present invention. The method comprises forming a metal bump on a wafer, applying a high polymer resin coating to the wafer, grinding a surface of the resin coating, printing an endpoint on the wafer, a grinding and cutting step and bonding the chips to an antenna or substrate with SMT. The present invention can be used to manufacture high quality chips of low cost with mass production to significantly reduce cost and maintain high quality of the products.