For the Inventor, By the Inventor

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Changwon-si, South Korea

Mds Co., Ltd.

USPTO Granted Patents = 3

Forward Citations = 7

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8 inventors (with patents filed for the assignee):

Se-Chuel Park (1 out of 5 patents)

Sung-Kwan Paek (1 out of 3 patents)

Jin-Woo Lee (1 out of 1 patent)

4. Jae-Hoon Jang (1 out of 1 patent)

5. Dong-Hoon Lee (1 out of 1 patent)

6. Jae-Ha Kim (1 out of 1 patent)

7. Soon Chul Kwon (1 out of 1 patent)

8. Sang Shin Lee (1 out of 27 patents)

3 patents: Sort by Forward Citations

1. 8937378 - Lead frame and semiconductor package including the same (2015-01-20),

2. 8846421 - Method of manufacturing lead frame for light-emitting device package and light-emitting device package (2014-09-30),

3. 8828247 - Method of manufacturing printed circuit board having vias and fine circuit and printed circuit board manufactured using the same (2014-09-09),

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USPTO Data Jan 1 1976 - Dec 30 2025

3 Patents

#20 in Changwon-si

#2,648 in South Korea

Changwon-si, South Korea

Mds Co., Ltd.

Forward Citations = 7

8 inventors:

Se-Chuel Park (1 out of 5 patents)

Sung-Kwan Paek (1 out of 3 patents)

Jin-Woo Lee (1 out of 1 patent)

4. Jae-Hoon Jang (1 out of 1 patent)

5. Dong-Hoon Lee (1 out of 1 patent)

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