The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2014
Filed:
Mar. 09, 2012
Applicants:
Jin-woo Lee, Chanwon, KR;
Jae-hoon Jang, Chanwon, KR;
Dong-hoon Lee, Chanwon, KR;
Jae-ha Kim, Chanwon, KR;
Inventors:
Jin-Woo Lee, Chanwon, KR;
Jae-Hoon Jang, Chanwon, KR;
Dong-Hoon Lee, Chanwon, KR;
Jae-Ha Kim, Chanwon, KR;
Assignee:
MDS Co. Ltd., Changwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/62 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 2933/0066 (2013.01); H01L 33/60 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01);
Abstract
A method of manufacturing a lead frame for a light-emitting device package and a light-emitting device package are provided. The method of manufacturing a lead frame for a light-emitting device package includes: preparing a base substrate for the lead frame; forming diffusion roughness on the base substrate; and forming a reflective plating layer on the diffusion roughness formed base substrate.