For the Inventor, By the Inventor

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Campbell, CA, United States of America

Keyssa, Inc.

USPTO Granted Patents = 95

% Expired Patents = 5.3

EPO Patents = 24

Trademarks = 2

Forward Citations = 449

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27 inventors (with patents filed for the assignee):

Gary Davis McCormack (87 out of 96 patents)

Ian A Kyles (65 out of 79 patents)

Roger Dwain Isaac (34 out of 63 patents)

4. Emilio A Sovero (6 out of 23 patents)

5. Steve Novak (6 out of 7 patents)

6. Eric Sweetman (6 out of 15 patents)

7. John Wolcott (5 out of 6 patents)

8. Eric Almgren (5 out of 5 patents)

9. Norbert Seitz (4 out of 5 patents)

10. Kenneth R Kveton (3 out of 3 patents)

11. Michael A Bourdess (3 out of 3 patents)

12. Bojana Zivanovic (3 out of 7 patents)

13. Bhupendra Sarhad (3 out of 4 patents)

14. Christopher Scott Sansom (3 out of 4 patents)

15. Srikanth Gondi (3 out of 22 patents)

Core Competencies:

EHF Communication

Contactless Data Transfer

Smart Connectors

Secure Communication

Electromagnetic Signals

Modular Electronics

Dielectric Medium

High-Bandwidth Connectivity

Proximity Sensing

Virtualized Physical Layer

Waveguide Assembly

Signal Splicing

95 patents: Sort by Forward Citations

1. 11013057 - Extremely high frequency systems and methods of operating the same (2021-05-18),

2. 10965347 - Tightly-coupled near-field communication-link connector-replacement chips (2021-03-30),

3. 10925111 - EHF secure communication device (2021-02-16),

4. 10903875 - Virtualized physical layer adapted for EHF contactless communication (2021-01-26),

5. 10797916 - EHF receiver architecture with dynamically adjustable discrimination threshold (2020-10-06),

6. 10707557 - Wireless communication with dielectric medium (2020-07-07),

7. 10651559 - Redirection of electromagnetic signals using substrate structures (2020-05-12),

8. 10602363 - EHF secure communication device (2020-03-24),

9. 10601470 - Contactless data transfer systems and methods (2020-03-24),

10. 10601105 - Scalable high-bandwidth connectivity (2020-03-24),

11. 10595124 - Full duplex contactless communication systems and methods for the use thereof (2020-03-17),

12. 10592461 - Extremely high frequency systems and methods of operating the same to establish USB data transport protocols (2020-03-17),

13. 10588002 - Smart connectors and associated communications links (2020-03-10),

14. 10581489 - Physical layer adapted for EHF contactless communication (2020-03-03),

15. 10523278 - Modular electronics (2019-12-31),

Company Overview

Keyssa, Inc., based in Campbell, California, specializes in advanced EHF (Extremely High Frequency) communication technologies. The company focuses on enabling contactless data transfer through innovative smart connectors that facilitate secure communication and high-bandwidth connectivity. Keyssa's solutions leverage electromagnetic signals and dielectric mediums to enhance modular electronics, making them suitable for a variety of applications in consumer electronics and beyond. Their commitment to pioneering secure and efficient data transfer positions them at the forefront of modern connectivity solutions.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

95 Patents

#7 in Campbell, CA

#914 in California

#3,940 in US

#8,111 in the World

Campbell, CA, United States of America

Keyssa, Inc.

Forward Citations = 449

27 inventors:

Gary Davis McCormack (87 out of 96 patents)

Ian A Kyles (65 out of 79 patents)

Roger Dwain Isaac (34 out of 63 patents)

4. Emilio A Sovero (6 out of 23 patents)

5. Steve Novak (6 out of 7 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Keyssa, Inc.. Retrieved from https://idiyas.com/company/keyssa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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