The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Jun. 24, 2019
Applicant:

Keyssa, Inc., Campbell, CA (US);

Inventors:

Gary D. McCormack, Tigard, OR (US);

Ian A. Kyles, West Linn, OR (US);

Assignee:

Keyssa, Inc., Campbell, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 7/00 (2006.01); H01Q 1/22 (2006.01); H04B 1/18 (2006.01); H01L 23/552 (2006.01); H04B 5/00 (2006.01); H05K 1/14 (2006.01); H01L 23/48 (2006.01); H01L 23/66 (2006.01); H01Q 7/00 (2006.01); H01Q 9/26 (2006.01); H01Q 23/00 (2006.01); H05K 9/00 (2006.01); H05K 1/02 (2006.01); H01L 23/495 (2006.01); H04B 1/40 (2015.01); H01Q 1/38 (2006.01); H01Q 9/04 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2291 (2013.01); H01L 23/48 (2013.01); H01L 23/495 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01Q 1/38 (2013.01); H01Q 7/00 (2013.01); H01Q 9/0485 (2013.01); H01Q 9/265 (2013.01); H01Q 23/00 (2013.01); H04B 1/18 (2013.01); H04B 1/40 (2013.01); H04B 5/0031 (2013.01); H04B 5/0037 (2013.01); H05K 1/0243 (2013.01); H05K 1/144 (2013.01); H05K 9/0056 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45099 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/207 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01); H05K 1/181 (2013.01); H05K 2201/0723 (2013.01); H05K 2201/10522 (2013.01);
Abstract

An electronic device may include a dielectric substrate, an electronic circuit supported by the substrate, for processing data, and a communication unit having an antenna. The communication unit may be mounted to the substrate in communication with the electronic circuit for converting between a first EHF electromagnetic signal containing digital information and a data signal conducted by the electronic circuit. The electromagnetic signal may be transmitted or received along a signal path by the antenna. An electromagnetic signal guide assembly may include a dielectric element made of a dielectric material disposed proximate the antenna in the signal path. The electromagnetic signal guide may have sides extending along the signal path. A sleeve element may extend around the dielectric element along sides of the dielectric element. The sleeve element may impede transmission of the electromagnetic signal through the sides of the dielectric element.


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