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For the Inventor, By the Inventor

Saitama, Japan

Kayaba Office Co., Ltd.

Calculating rank
USPTO Granted Patents = 2


Forward Citations = 0

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3 inventors (with patents filed for the assignee):

goldMedal Akira Ogihara (2 out of 6 patents)

silverMedal Masao Kayaba (2 out of 2 patents)

bronzeMedal Hisao Ishikawa (2 out of 2 patents)

4.  Hisao Ishikawa (0 patent)


2 patents:

1. 12392015 - Printed wiring board, printed circuit board, and electronic component (2025-08-19),
2. 11802322 - Method for manufacturing solder product, solder, soldered component, printed wiring board, printed circuit board, wire, soldered product, flexible printed board, electronic component, method for manufacturing tin article, method for manufacturing tin intermediate product, tin intermediate product, and conductive member (2023-10-31),
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USPTO Data Jan 1 1976 - Nov 3 2026

2 Patents

#187 in Saitama 343-0827

#11,143 in Japan

Saitama, JP
Saitama, Japan

Kayaba Office Co., Ltd.

Forward Citations = 0

3 inventors:

goldMedal Akira Ogihara (2 out of 6 patents)

silverMedal Masao Kayaba (2 out of 2 patents)

bronzeMedal Hisao Ishikawa (2 out of 2 patents)

4.  Hisao Ishikawa (0 patent)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Kayaba Office Co., Ltd.. Retrieved from https://idiyas.com/company/kayaba-office-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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