The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2025
Filed:
Sep. 18, 2023
Applicants:
Ishikawa Technology Laboratory Co., Ltd., Tochigi, JP;
Kayaba Office Co., Ltd., Saitama, JP;
Akira Ogihara, Kanagawa, JP;
Inventors:
Assignees:
ISHIKAWA TECHNOLOGY LABORATORY CO., LTD., Tochigi, JP;
KAYABA OFFICE CO., LTD., Saitama, JP;
[object Object];
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); B23K 101/42 (2006.01); C22C 1/02 (2006.01); C22C 13/00 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
C22C 1/02 (2013.01); B23K 35/262 (2013.01); C22C 13/00 (2013.01); H05K 1/181 (2013.01); H05K 3/3463 (2013.01); B23K 2101/42 (2018.08);
Abstract
A solder productincludes: a lead-free solder partcontaining tin as a main component and a metal element other than lead as a secondary component; and a carboxylic acid having 10 to 20 carbons, the carboxylic acid being mainly distributed over the surface of the solder productto form a surface layer. The carboxylic acid is preferably a fatty acid having 12 to 16 carbons, and more preferably a palmitic acid.