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For the Inventor, By the Inventor

Tochigi, Japan

Ishikawa Technology Laboratory Co., Ltd.

Calculating rank
USPTO Granted Patents = 2


Forward Citations = 0

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3 inventors (with patents filed for the assignee):

goldMedal Akira Ogihara (2 out of 6 patents)

silverMedal Masao Kayaba (2 out of 2 patents)

bronzeMedal Hisao Ishikawa (2 out of 2 patents)

4.  Hisao Ishikawa (0 patent)


2 patents:

1. 12392015 - Printed wiring board, printed circuit board, and electronic component (2025-08-19),
2. 11802322 - Method for manufacturing solder product, solder, soldered component, printed wiring board, printed circuit board, wire, soldered product, flexible printed board, electronic component, method for manufacturing tin article, method for manufacturing tin intermediate product, tin intermediate product, and conductive member (2023-10-31),
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USPTO Data Jan 1 1976 - Nov 3 2026

2 Patents

#36 in Tochigi

#11,154 in Japan

Tochigi, JP
Tochigi, Japan

Ishikawa Technology Laboratory Co., Ltd.

Forward Citations = 0

3 inventors:

goldMedal Akira Ogihara (2 out of 6 patents)

silverMedal Masao Kayaba (2 out of 2 patents)

bronzeMedal Hisao Ishikawa (2 out of 2 patents)

4.  Hisao Ishikawa (0 patent)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Ishikawa Technology Laboratory Co., Ltd.. Retrieved from https://idiyas.com/company/ishikawa-technology-laboratory-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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