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For the Inventor, By the Inventor

Boulder, CO, United States of America

Interconnect Technology LLC


USPTO Granted Patents = 2

% Expired Patents = 50.0

Forward Citations = 268

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2 inventors (with patents filed for the assignee):

goldMedal Herzel Laor (1 out of 34 patents)

silverMedal Larry W Burgess (1 out of 1 patent)


2 patents:

1. 6516121 - Configuring optical fibers in a multi-chip module (2003-02-04),
2. 4642160 - Multilayer circuit board manufacturing (1987-02-10),
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USPTO Data Jan 1 1976 - Sep 15 2026

2 Patents

#397 in Boulder, CO

#2,352 in Colorado

#94,628 in US

Boulder, CO (US)
Boulder, CO, United States of America

Interconnect Technology LLC

Forward Citations = 268

2 inventors:

goldMedal Herzel Laor (1 out of 34 patents)

silverMedal Larry W Burgess (1 out of 1 patent)

Please report any incorrect information to [email protected]
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