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For the Inventor, By the Inventor

Boulder, CO, United States of America

Interconnect Technology LLC


USPTO Granted Patents = 2

Forward Citations = 265

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2 inventors (with patents filed for the assignee):

goldMedal Herzel Laor (1 out of 34 patents)

silverMedal Larry W Burgess (1 out of 1 patent)


2 patents:

1. 6516121 - Configuring optical fibers in a multi-chip module (2003-02-04),
2. 4642160 - Multilayer circuit board manufacturing (1987-02-10),
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USPTO Data Jan 1 1976 - Dec 23 2025

2 Patents

#381 in Boulder, CO

#2,278 in Colorado

#92,558 in US

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Boulder, CO, United States of America

Interconnect Technology LLC

Forward Citations = 265

2 inventors:

goldMedal Herzel Laor (1 out of 34 patents)

silverMedal Larry W Burgess (1 out of 1 patent)

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