Configuring optical fibers in a multi-chip module

Abstract

The present invention is directed to a methodology, structure and process ( ) for routing connecting, and forming optical fibers between optical ports such as optical transmitters and receivers/detectors to create optical pathways for signal transfer therebetween. More particularly, when connecting timed optoelectronic chips on a Multi Chip Module, an optical fiber is aligned above an optical port ( ), the fiber and the port surface are heated ( ), ( ) and contacted ( ) creating an adhesion bond therebetween. The fiber is then routed ( ) to another optical port for connection ( ). The fiber may then be connected to additional ports ( ) or severed ( ). Once severed, the optical pathway may be adjusted to synchronize timing between optoelectronic chips. If a chip's timing is advanced or delayed, the connecting optical pathway may be lengthened ( ) or shortened ( ). Last, the optical fibers are annealed ( ) to relieve internal stresses and cure surface defects.