CIPO Patents = 3

Forward Citations = 29

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19 inventors (with patents filed for the assignee):

Ryuichi Ishitsubo (6 out of 11 patents)

Toshihiro Hosokawa (5 out of 22 patents)

Masahito Matsumoto (3 out of 64 patents)

4. Kiyoshi Nakahara (3 out of 4 patents)

5. Toshiyuki Okuda (3 out of 4 patents)

6. Nobuhiro Usui (2 out of 60 patents)

7. Shohei Masui (2 out of 9 patents)

8. Youichi Fujiyama (1 out of 2 patents)

9. Takashi Watanabe (1 out of 1 patent)

10. Toshihiro Hosokawa (0 patent)

11. Ryuichi Ishitsubo (0 patent)

12. Shohei Masui (0 patent)

13. Matsahito Matsumoto (0 patent)

14. Masahito Matsumoto (0 patent)

15. Nobuhiro Usui (0 patent)

6 patents: Sort by Forward Citations

1. 5714175 - Apparatus for producing a multilayer molded article (1998-02-03),

2. 5622667 - Process for producing skin-integrated laminate (1997-04-22),

3. 5545023 - Pressure molding apparatus for molten resin (1996-08-13),

4. 5338182 - Pressure molding apparatus for molten resin (1994-08-16),

5. 5234336 - Pressure molding apparatus for molten resin (1993-08-10),

6. 5122320 - Process for producing a multilayer article (1992-06-16),

Hosokawa Seisakusho Co., Ltd. is a leading manufacturer of industrial machinery and equipment, specializing in powder and particle processing technologies. Founded in 1948, the company has gained a reputation for innovative solutions and high-quality products. With a focus on research and development, Hosokawa Seisakusho continues to meet the evolving needs of industries worldwide.

This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 9 2025

6 Patents

#562 in Osaka

#5,840 in Japan

Osaka, Japan

Hosokawa Seisakusho Co., Ltd.