The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 10, 1993
Filed:
Jun. 12, 1990
Toshihiro Hosokawa, Osaka, JP;
Kiyoshi Nakahara, Osaka, JP;
Ryuichi Ishitsubo, Osaka, JP;
Toshiyuki Okuda, Osaka, JP;
Hosokawa Seisakusho Co., Ltd., Osaka, JP;
Abstract
The invention provides a pressure molding apparatus for molten resin capable of efficiently maintaining the temperature of molten resin in the gate pipe, which is provided with molten-resin feeding gate pipes beneath the gate aperture of a molding unit composed of upper and lower molds in order that molten resin can be delivered to the interior of the molding unit before being pressed and molded, where the heater unit for maintaining the temperature of molten resin is disposed in the external periphery of the gate pipes in the state of being divided into two units in the vertical direction. Opposite portions of the gate pipe vertically being divided into two units are connected to each other so that length can optionally be adjusted to the extended or contracted direction, wherein the heater unit is discretely provided in the periphery of the gate pipes which are separately disposed.