The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 1994
Filed:
Mar. 24, 1992
Toshihiro Hosokawa, Osaka, JP;
Kiyoshi Nakahara, Osaka, JP;
Ryuichi Ishitsubo, Osaka, JP;
Toshiyuki Okuda, Osaka, JP;
Hosokawa Seisakusho Co., Ltd., Osaka, JP;
Abstract
This invention is directed to a pressure molding apparatus for molten resin in which an oil-pressurized cylinder internally holding an end of gate pin can freely move in compatibility with thermal elongation or contraction of a manifold pipe. In addition, a limit switch to be activated by the descending movement of this cylinder in correspondence with the descending movement of the gate pin is interlinked to a molten-resin supply source. By provision of these mechanisms, molten resin can smoothly be delivered to the interior of a molding unit without obstruction. Since substantial space is provided around this cylinder, pipes can easily be installed. Furthermore, the inner lateral surface of the gate aperture on the side of the gate pin is provided with an obtuse angle wider than the tip angle of the gate pin, and a tapered hole having an adequate length and tapered diameter expanding itself from the gate aperture to the inner surface of the molding unit is provided. By provision of the above structure, the gate aperture is prevented from being choked by residual resin and a concave indentation cannot be generated in the molded resin product at the portion corresponding to the gate aperture.