For the Inventor, By the Inventor

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Hong Kong, China

High Tech Technology Limited

USPTO Granted Patents = 3

Forward Citations = 2

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9 inventors (with patents filed for the assignee):

Chik Wai (David) Ng (3 out of 8 patents)

Ka Lok (Roy) Ng (2 out of 2 patents)

Wai Kit (Victor) So (2 out of 6 patents)

4. Tin Ho (Andy) Wu (2 out of 5 patents)

5. Kit Wing (Simon) Lee (1 out of 1 patent)

6. Sheung Wai (Orange) Fung (1 out of 1 patent)

7. Yuanzhe (Kevin) Xu (1 out of 1 patent)

8. Ki Hin (Gary) Choi (1 out of 1 patent)

9. Kwun Yuan (Godwin) Ho (1 out of 1 patent)

3 patents: Sort by Forward Citations

1. 11990422 - Ferrite electro-magnetic interference (EMI) shield between an integrated-circuit (IC) chip and an air-core inductor all inside a hybrid lead-frame package (2024-05-21),

2. 11258364 - Flexible array of DC-DC converters reconfigurable using a shared serial bus (2022-02-22),

3. 11206014 - Digital frequency dithering for switched-mode power supplies (SMPS) using triangular, asymmetric cubic, or random cubic spread spectrum oscillators (2021-12-21),

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USPTO Data Jan 1 1976 - Dec 16 2025

3 Patents

#900 in Hong Kong

#7,221 in China

Hong Kong, China

High Tech Technology Limited

Forward Citations = 2

9 inventors:

Chik Wai (David) Ng (3 out of 8 patents)

Ka Lok (Roy) Ng (2 out of 2 patents)

Wai Kit (Victor) So (2 out of 6 patents)

4. Tin Ho (Andy) Wu (2 out of 5 patents)

5. Kit Wing (Simon) Lee (1 out of 1 patent)

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