Buffalo, NY, United States of America

Harper International Corporation


USPTO Granted Patents = 13

% Expired Patents = 7.7



Trademarks = 7

Forward Citations = 84

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17 inventors (with patents filed for the assignee):

goldMedal Edward V McCormick (5 out of 7 patents)

silverMedal Bruce J Dover (5 out of 6 patents)

bronzeMedal William J Stry (4 out of 4 patents)

4.  Renee M Bagwell (2 out of 2 patents)

5.  David M Bencic (2 out of 4 patents)

6.  Carl H Vander Weide (2 out of 2 patents)

7.  Peter R Witting (1 out of 1 patent)

8.  Jeffrey E Purdy (1 out of 1 patent)

9.  Jason A Ginn (1 out of 1 patent)

10.  Charles Miller (1 out of 1 patent)

11.  Uwe Hoechst (1 out of 1 patent)

12.  Ludger Fischer (1 out of 2 patents)

13.  Brian A Polino (1 out of 1 patent)

14.  Douglas E Ludwig (1 out of 1 patent)

15.  Edgard Matrak (1 out of 2 patents)


13 patents:

Company Overview
Harper International Corporation is a leading provider of thermal processing solutions, specializing in the design and manufacture of advanced systems for the production of materials such as ceramics, metals, and composites. With a focus on innovation, Harper develops custom equipment and processes that enhance efficiency and performance in various industries. Headquartered in Buffalo, NY, the company leverages its expertise to serve clients globally, ensuring high-quality solutions tailored to meet specific material processing needs.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 6 2026

13 Patents

#29 in Buffalo, NY

#1,374 in New York

#23,815 in US

#44,988 in the World

Buffalo, NY (US)
Buffalo, NY, United States of America
Forward Citations = 84

17 inventors:

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Harper International Corporation. Retrieved from https://idiyas.com/company/harper-international

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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