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For the Inventor, By the Inventor

Hsinchu, Taiwan

Gloval Unichip Corp.


USPTO Granted Patents = 1

Forward Citations = 3

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2 inventors (with patents filed for the assignee):

goldMedal Yi-Chieh Wang (1 out of 4 patents)

silverMedal Tsung C Whang (1 out of 8 patents)


1 patent:

1. 9111846 - Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof (2015-08-18),
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USPTO Data Jan 1 1976 - Dec 30 2025

1 Patents

#475 in Hsinchu

#5,938 in Taiwan

...
Hsinchu, Taiwan

Gloval Unichip Corp.

Forward Citations = 3

2 inventors:

goldMedal Yi-Chieh Wang (1 out of 4 patents)

silverMedal Tsung C Whang (1 out of 8 patents)

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