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For the Inventor, By the Inventor

Chino, CA, United States of America

Enzotechnology Corp.


USPTO Granted Patents = 2

Trademarks = 1

Forward Citations = 2

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3 inventors (with patents filed for the assignee):

goldMedal Kuo-An Liang (1 out of 2 patents)

silverMedal Chen-Chang Wu (1 out of 1 patent)

bronzeMedal Ching-Hsing Liao (1 out of 1 patent)


2 patents:

1. 9984955 - Lightweight liquid-cooling-plate assembly having plastic frame and heat dissipation system using same (2018-05-29),
2. 8687368 - Heat-dissipating module and assembled structure of heat-dissipating module and integrated circuit chipset (2014-04-01),
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USPTO Data Jan 1 1976 - Jan 6 2026

2 Patents

#41 in Chino, CA

#20,566 in California

#92,696 in US

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Chino, CA, United States of America

Enzotechnology Corp.

Forward Citations = 2

3 inventors:

goldMedal Kuo-An Liang (1 out of 2 patents)

silverMedal Chen-Chang Wu (1 out of 1 patent)

bronzeMedal Ching-Hsing Liao (1 out of 1 patent)

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