Chen-Chang Wu

Title: Innovations of Chen-Chang Wu

Introduction

Chen-Chang Wu is a notable inventor based in Taoyuan Hsien, Taiwan. He has made significant contributions to the field of integrated circuit technology. His innovative work has led to the development of a unique heat-dissipating module that enhances the performance of integrated circuit chipsets.

Latest Patents

Chen-Chang Wu holds a patent for a "Heat-dissipating module and assembled structure of heat-dissipating module and integrated circuit chipset." This patent describes an assembled structure that includes an integrated circuit chipset and a heat-dissipating module. The heat-dissipating module consists of a heat sink, a locking member, and at least one elastic element. The heat sink features a base and multiple fins, while the locking member includes a rectangular frame with sustaining parts. The design incorporates hooks that engage with the substrate of the integrated circuit chipset, ensuring effective heat dissipation.

Career Highlights

Chen-Chang Wu is currently associated with Enzotechnology Corp., where he continues to innovate in the field of technology. His work focuses on improving the efficiency and reliability of electronic components. His contributions have been instrumental in advancing the capabilities of integrated circuits.

Collaborations

Chen-Chang Wu collaborates with Ching-Hsing Liao, working together to push the boundaries of technology and innovation. Their partnership has led to the development of cutting-edge solutions in the industry.

Conclusion

Chen-Chang Wu's innovative work in heat-dissipating technology showcases his commitment to enhancing electronic performance. His contributions are vital to the ongoing evolution of integrated circuit technology.