Company Filing History:
Years Active: 2014
Title: Innovations of Ching-Hsing Liao in Heat Dissipation Technology.
Introduction
Ching-Hsing Liao is a notable inventor based in Taoyuan Hsien, Taiwan. He has made significant contributions to the field of heat dissipation technology, particularly through his innovative designs that enhance the performance of integrated circuit chipsets. His work is characterized by a focus on efficiency and functionality, which is crucial in today's technology-driven world.
Latest Patents
Liao holds a patent for a "Heat-dissipating module and assembled structure of heat-dissipating module and integrated circuit chipset." This invention features an assembled structure that includes an integrated circuit chipset and a heat-dissipating module. The heat-dissipating module comprises a heat sink, a locking member, and at least one elastic element. The design includes a base and multiple fins in the heat sink, along with a rectangular frame that supports the structure. The innovative use of hooks and elastic elements ensures effective engagement with the integrated circuit chipset, enhancing its thermal management capabilities.
Career Highlights
Ching-Hsing Liao is currently employed at Enzotechnology Corporation, where he continues to develop cutting-edge technologies in heat dissipation. His work at the company has positioned him as a key player in advancing thermal management solutions for electronic devices. Liao's dedication to innovation is evident in his patent, which reflects his expertise and commitment to improving technology.
Collaborations
Liao collaborates with Chen-Chang Wu, a talented engineer who contributes to the development of innovative solutions in their field. Their partnership exemplifies the importance of teamwork in driving technological advancements.
Conclusion
Ching-Hsing Liao's contributions to heat dissipation technology through his patent demonstrate his innovative spirit and commitment to enhancing electronic performance. His work at Enzotechnology Corporation and collaboration with colleagues further highlight the significance of teamwork in achieving technological breakthroughs.