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West Haven, CT, United States of America

Enthone-Omi, Inc.

USPTO Granted Patents = 34

Trademarks = 20

Forward Citations = 583

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42 inventors (with patents filed for the assignee):

Vincent Paneccasio, Jr (4 out of 38 patents)

Sylvia Martin (4 out of 4 patents)

Jay B Conrod (4 out of 4 patents)

4. John H Commander (3 out of 3 patents)

5. Patricia A Cacciatore (3 out of 4 patents)

6. Paul Menkin (2 out of 17 patents)

7. Elena H Too (2 out of 3 patents)

8. Mark W Zitko (2 out of 2 patents)

9. Juan B Haydu (2 out of 6 patents)

10. Gary R Sutcliffe (2 out of 2 patents)

11. Victor J Waldman (2 out of 2 patents)

12. Walter J Wieczerniak (2 out of 2 patents)

13. Paul R Gerst (1 out of 6 patents)

14. Robert R Oberle (1 out of 2 patents)

15. Robert Janik (1 out of 1 patent)

Core Competencies:

Electroless Plating

Ductility Additives

Copper Metallization

Zinc Electroplating

EMI Shielding

PWB Manufacturing

Copper Brightening

Aluminum Treatment

Chromate Coatings

Electrorefining

Nickel Alloys

Acid Copper Baths

34 patents: Sort by Forward Citations

1. 6261637 - Use of palladium immersion deposition to selectively initiate electroless plating on Ti and W alloys for wafer fabrication (2001-07-17),

2. 6183622 - Ductility additives for electrorefining and electrowinning (2001-02-06),

3. 6146702 - Electroless nickel cobalt phosphorous composition and plating process (2000-11-14),

4. 6080447 - Low etch alkaline zincate composition and process for zincating aluminum (2000-06-27),

5. 6054037 - Halogen additives for alkaline copper use for plating zinc die castings (2000-04-25),

6. 6045682 - Ductility agents for nickel-tungsten alloys (2000-04-04),

7. 6024856 - Copper metallization of silicon wafers using insoluble anodes (2000-02-15),

8. 6013203 - Coatings for EMI/RFI shielding (2000-01-11),

9. 5998237 - Method for adding layers to a PWB which yields high levels of copper to (1999-12-07),

10. 5928435 - Method for removing organic coatings from substrates using carboxylic (1999-07-27),

11. 5853556 - Use of hydroxy carboxylic acids as ductilizers for electroplating (1998-12-29),

12. 5733429 - Polyacrylic acid additives for copper electrorefining and electrowinning (1998-03-31),

13. 5730854 - Alkoxylated dimercaptans as copper additives and de-polarizing additives (1998-03-24),

14. 5730809 - Passivate for tungsten alloy electroplating (1998-03-24),

15. 5630950 - Copper brightening process and bath (1997-05-20),

Company Overview

Enthone-Omi, Inc. is a leading provider of advanced materials and surface finishing technologies, specializing in the development and manufacturing of high-performance coatings and chemical solutions. The company focuses on enhancing the durability, functionality, and aesthetics of various substrates across multiple industries, including electronics, automotive, and industrial applications. With a commitment to innovation, Enthone-Omi leverages its expertise to deliver tailored solutions that meet the evolving needs of its global clientele.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

34 Patents

#5 in West Haven, CT

#261 in Connecticut

#10,002 in US

#19,612 in the World

West Haven, CT, United States of America

Enthone-Omi, Inc.

Forward Citations = 583

42 inventors:

Vincent Paneccasio, Jr (4 out of 38 patents)

Sylvia Martin (4 out of 4 patents)

Jay B Conrod (4 out of 4 patents)

4. John H Commander (3 out of 3 patents)

5. Patricia A Cacciatore (3 out of 4 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Enthone-Omi, Inc.. Retrieved from https://idiyas.com/company/enthone-omi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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