Enter assignee name

Forward Citations = 8

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9 inventors (with patents filed for the assignee):

Carl Rudd (4 out of 4 patents)

Arthur Gernt Bond, Iii (4 out of 4 patents)

Brian A English (3 out of 4 patents)

4. Michael S Kranz (3 out of 3 patents)

5. Mark Lee Adams (2 out of 2 patents)

6. Robert Neal Dean, Jr (2 out of 3 patents)

7. Brent Douglas Bottenfield (2 out of 2 patents)

8. Benoit Hamelin (2 out of 5 patents)

9. Charles Fredrick Rogers, IV (1 out of 1 patent)

6 patents: Sort by Forward Citations

1. 12610844 - Systems and methods for additive connections in integrated circuits (2026-04-21),

2. 12272511 - Multi-material thermionic electron emitters (2025-04-08),

3. 12080505 - Multi-material thermionic electron emitters (2024-09-03),

4. 11613460 - Systems, methods, and devices for mechanical isolation or mechanical damping of microfabricated inertial sensors (2023-03-28),

5. 11312619 - Methods of manufacture of microisolators and devices for mechanical isolation or mechanical damping of microfabricated inertial sensors (2022-04-26),

6. 10988375 - Systems, methods, and devices for mechanical isolation or mechanical damping of microfabricated inertial sensors (2021-04-27),

Engeniusmicro, LLC is a leading provider of advanced semiconductor solutions, specializing in high-performance microchips for various applications. With a focus on innovation and quality, we strive to deliver cutting-edge technology to our clients in industries such as automotive, telecommunications, and consumer electronics.

Profile summary based on public USPTO records.