The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2026
Filed:
Apr. 20, 2023
Applicant:
Engeniusmicro, Llc, Huntsville, AL (US);
Inventors:
Charles Fredrick Rogers, IV, Huntsville, AL (US);
Carl Anders Rudd, Huntsville, AL (US);
Assignee:
EngeniusMicro, LLC, Huntsville, AL (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 21/56 (2013.01); H01L 23/3185 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29193 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/834 (2013.01); H01L 2224/83487 (2013.01); H01L 2224/8349 (2013.01); H01L 2224/83493 (2013.01); H01L 2224/83888 (2013.01);
Abstract
A system and method for forming a bonded integrated circuit, comprising dispensing a dielectric material on a first side of an integrated circuit, shaping the dielectric material on the first side of the integrated circuit to form a first dielectric surface; and dispensing a conductive material between a first printed circuit board (PCB) top surface and a top surface of the integrated circuit to form a first connection, the first connection situated on the first dielectric surface.