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For the Inventor, By the Inventor

Bassersdorf, Switzerland

Dyconex Ag


USPTO Granted Patents = 14

% Expired Patents = 35.7


Trademarks = 1

Forward Citations = 40

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14 inventors (with patents filed for the assignee):

goldMedal Marc Hauer (10 out of 17 patents)

silverMedal Eckardt Bihler (5 out of 10 patents)

bronzeMedal Thomas Doerr (2 out of 139 patents)

4.  Walter Schmidt (2 out of 20 patents)

5.  Dirk Muessig (1 out of 71 patents)

6.  Jochen Held (1 out of 2 patents)

7.  Markus Riester (1 out of 6 patents)

8.  Stefan Eck (1 out of 5 patents)

9.  Pavlin Sabev (1 out of 1 patent)

10.  Marco Martinelli (1 out of 10 patents)

11.  Sven Johannsen (1 out of 1 patent)

12.  Daniel Luchsinger (1 out of 1 patent)

13.  Stephan Messerli (1 out of 1 patent)

14.  Hans-Peter Klein (1 out of 1 patent)

15.  Thomas Dörr (8 patents)


14 patents:

1. 12343539 - Implant comprising embedded conductor track and production method (2025-07-01),
2. 11940481 - Electrical connection test for unpopulated printed circuit boards (2024-03-26),
3. 11541244 - Detachable seal for medical implants (2023-01-03),
4. 11504506 - Strain sensor for a medical devices with improved measurement sensitivity (2022-11-22),
5. 11456277 - Thermocompression bonding of electronic components (2022-09-27),
6. 10932386 - Electronic module and method for producing same (2021-02-23),
7. 9357968 - Self-cleaning sensor surfaces for implantable sensor systems (2016-06-07),
8. 8679010 - Implantable sensor device (2014-03-25),
9. 8677615 - Method for embedding electrical components (2014-03-25),
10. 8509898 - Electronic device or electric component (2013-08-13),
11. 7892625 - Method of fabricating an electrical connecting element, and an electrical connecting element (2011-02-22),
12. 7691276 - Method for manufacturing an electrical connecting element, and a connecting element (2010-04-06),
13. 6954986 - Method for fabricating electrical connecting element (2005-10-18),
14. 5382505 - Method of making a laminated structure with shear force delamination (1995-01-17),
Company Overview
Dyconex AG is a Swiss company specializing in the development and manufacturing of advanced interconnect solutions for various industries. With a focus on high-precision microelectronics, Dyconex provides innovative technologies for applications in telecommunications, automotive, and medical devices. The company emphasizes quality and reliability in its products, catering to the evolving needs of its global clientele. Its expertise in microfabrication and circuit technology positions Dyconex as a key player in the interconnect market.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 20 2026

14 Patents

#1 in Bassersdorf

#841 in Switzerland

#42,290 in the World

Bassersdorf, CH
Bassersdorf, Switzerland

Dyconex Ag

Forward Citations = 40

14 inventors:

goldMedal Marc Hauer (10 out of 17 patents)

silverMedal Eckardt Bihler (5 out of 10 patents)

bronzeMedal Thomas Doerr (2 out of 139 patents)

4.  Walter Schmidt (2 out of 20 patents)

5.  Dirk Muessig (1 out of 71 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Dyconex Ag. Retrieved from https://idiyas.com/company/dyconex-ag

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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