The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2021
Filed:
May. 31, 2018
Applicant:
Dyconex Ag, Bassersdorf, CH;
Inventors:
Assignee:
DYCONEX AG, Bassersdorf, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/06 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); A61N 1/375 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); H05K 3/30 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 5/065 (2013.01); A61N 1/3752 (2013.01); H01L 23/4985 (2013.01); H01L 23/49811 (2013.01); H01L 24/24 (2013.01); H01L 24/81 (2013.01); H01L 24/82 (2013.01); H01L 24/92 (2013.01); H05K 1/028 (2013.01); H05K 1/0313 (2013.01); H05K 1/09 (2013.01); H05K 1/112 (2013.01); H05K 1/189 (2013.01); H05K 3/285 (2013.01); H05K 3/303 (2013.01); H05K 3/4076 (2013.01); A61N 1/3754 (2013.01); H01L 2224/80203 (2013.01); H01L 2224/80385 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81385 (2013.01); H01L 2224/81898 (2013.01); H01L 2224/821 (2013.01); H01L 2224/8236 (2013.01); H01L 2224/82138 (2013.01); H01L 2224/82203 (2013.01); H01L 2224/82895 (2013.01); H01L 2224/9212 (2013.01); H01L 2224/92124 (2013.01); H01L 2224/92144 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0154 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01); H05K 2203/166 (2013.01);
Abstract
An electronic module on a flexible planar circuit substrate with a conductor configuration on a first substrate surface and a plurality of electronic components on the opposite, second substrate surface, wherein the components have component contacts, which are electrically connected selectively by way of vias in the circuit substrate and the conductor configuration, wherein the circuit substrate is a thermoplastic polymer and the component contacts are melted or thermally pressed into the second substrate surface in the region of the vias.