% Expired Patents = 33.3

Forward Citations = 0

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8 inventors (with patents filed for the assignee):

Jin Seok Choi (2 out of 2 patents)

Hyun-Tak Kim (1 out of 31 patents)

Bongjun Kim (1 out of 11 patents)

4. Sun Shin Kwag (1 out of 1 patent)

5. Jun Sik Kim (1 out of 36 patents)

6. Sung Ji Choi (1 out of 1 patent)

7. Ji Hun Kim (1 out of 1 patent)

8. Ki Ho Park (1 out of 1 patent)

3 patents: Sort by Forward Citations

1. 11794971 - Laminated film to be applied to eco-friendly packaging material with high barrier properties (2023-10-24),

2. 11279538 - Lid packing material for food container (2022-03-22),

3. 8866538 - Constant current circuit of high efficiency (2014-10-21),

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

3 Patents

#191 in Gyeonggi-do

#2,789 in South Korea

Gyeonggi-do, South Korea

Dongwon Systems Corporation

Forward Citations = 0

8 inventors:

Jin Seok Choi (2 out of 2 patents)

Hyun-Tak Kim (1 out of 31 patents)

Bongjun Kim (1 out of 11 patents)

4. Sun Shin Kwag (1 out of 1 patent)

5. Jun Sik Kim (1 out of 36 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Dongwon Systems Corporation. Retrieved from https://idiyas.com/company/dongwon-systems

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]