The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2022
Filed:
Dec. 31, 2020
Applicant:
Dongwon Systems Corporation, Gyeonggi-do, KR;
Inventors:
Jin Seok Choi, Gyeonggi-do, KR;
Sung Ji Choi, Gyeonggi-do, KR;
Assignee:
DONGWON SYSTEMS CORPORATION, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 65/42 (2006.01); B32B 3/12 (2006.01); B32B 3/14 (2006.01); B32B 7/14 (2006.01); B32B 27/08 (2006.01); B32B 27/36 (2006.01);
U.S. Cl.
CPC ...
B65D 65/42 (2013.01); B32B 3/12 (2013.01); B32B 3/14 (2013.01); B32B 7/14 (2013.01); B32B 27/08 (2013.01); B32B 27/36 (2013.01); B32B 2255/10 (2013.01); B32B 2255/24 (2013.01); B32B 2305/30 (2013.01); B32B 2307/31 (2013.01); B32B 2307/538 (2013.01); B32B 2307/73 (2013.01); B32B 2391/00 (2013.01); B32B 2405/00 (2013.01); B32B 2435/02 (2013.01); B32B 2439/70 (2013.01); B32B 2553/00 (2013.01); B65D 2543/00 (2013.01); B65D 2543/00009 (2013.01); B65D 2543/00259 (2013.01); B65D 2543/00314 (2013.01);
Abstract
The example embodiments relate to a lid packing material for food container, and a lid packing material for food container according to an aspect of the example embodiments includes: a substrate layer; and a heat-adhesion layer formed on the substrate layer, wherein the heat-adhesion layer includes at least two types of wax having different melting points.