Enter assignee name

Forward Citations = 330

Loading Chart...

7 inventors (with patents filed for the assignee):

Wendell B Sander (8 out of 109 patents)

James L Young (7 out of 7 patents)

Changsheng Chen (7 out of 7 patents)

4. John G Richards (7 out of 17 patents)

5. Phil P Marcoux (6 out of 8 patents)

6. Hector Flores (5 out of 11 patents)

7. Donald Paul Richmond, Ii (4 out of 54 patents)

14 patents: Sort by Forward Citations

1. 6954130 - Integrated passive components and package with posts (2005-10-11),

2. 6946734 - Integrated passive components and package with posts (2005-09-20),

3. 6833986 - Integrated passive components and package with posts (2004-12-21),

4. 6414585 - Integrated passive components and package with posts (2002-07-02),

5. 6355981 - Wafer fabrication of inside-wrapped contacts for electronic devices (2002-03-12),

6. 6221751 - Wafer fabrication of die-bottom contacts for electronic devices (2001-04-24),

7. 6121119 - Resistor fabrication (2000-09-19),

8. 6051489 - Electronic component package with posts on the active side of the (2000-04-18),

9. 5910687 - Wafer fabrication of die-bottom contacts for electronic devices (1999-06-08),

10. 5904496 - Wafer fabrication of inside-wrapped contacts for electronic devices (1999-05-18),

11. 5789817 - Electrical apparatus with a metallic layer coupled to a lower region of (1998-08-04),

12. 5656547 - Method for making a leadless surface mounted device with wrap-around (1997-08-12),

13. 5592022 - Fabricating a semiconductor with an insulative coating (1997-01-07),

14. 5557149 - Semiconductor fabrication with contact processing for wrap-around flange (1996-09-17),

Chipscale, Inc. is a leading provider of semiconductor packaging solutions. With a focus on advanced chip-scale packaging technology, Chipscale offers innovative solutions for a wide range of industries, including automotive, telecommunications, and consumer electronics. The company's products are known for their high performance, reliability, and compact size, making them ideal for cutting-edge electronic devices. Visit Chipscale's website to learn more about their cutting-edge packaging technology and solutions.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

14 Patents

#409 in San Jose, CA

#5,156 in California

#21,640 in US

#40,937 in the World

San Jose, CA, United States of America

Chipscale, Inc.