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For the Inventor, By the Inventor

San Jose, CA, United States of America

Chipscale, Inc.

Calculating rank
USPTO Granted Patents = 14

% Expired Patents = 14.3

Forward Citations = 332

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7 inventors (with patents filed for the assignee):

goldMedal Wendell B Sander (8 out of 109 patents)

silverMedal James L Young (7 out of 7 patents)

bronzeMedal Changsheng Chen (7 out of 7 patents)

4.  John G Richards (7 out of 17 patents)

5.  Phil P Marcoux (6 out of 8 patents)

6.  Hector Flores (5 out of 11 patents)

7.  Donald Paul Richmond, Ii (4 out of 54 patents)


14 patents:

1. 6954130 - Integrated passive components and package with posts (2005-10-11),
2. 6946734 - Integrated passive components and package with posts (2005-09-20),
3. 6833986 - Integrated passive components and package with posts (2004-12-21),
4. 6414585 - Integrated passive components and package with posts (2002-07-02),
5. 6355981 - Wafer fabrication of inside-wrapped contacts for electronic devices (2002-03-12),
6. 6221751 - Wafer fabrication of die-bottom contacts for electronic devices (2001-04-24),
7. 6121119 - Resistor fabrication (2000-09-19),
8. 6051489 - Electronic component package with posts on the active side of the (2000-04-18),
9. 5910687 - Wafer fabrication of die-bottom contacts for electronic devices (1999-06-08),
10. 5904496 - Wafer fabrication of inside-wrapped contacts for electronic devices (1999-05-18),
11. 5789817 - Electrical apparatus with a metallic layer coupled to a lower region of (1998-08-04),
12. 5656547 - Method for making a leadless surface mounted device with wrap-around (1997-08-12),
13. 5592022 - Fabricating a semiconductor with an insulative coating (1997-01-07),
14. 5557149 - Semiconductor fabrication with contact processing for wrap-around flange (1996-09-17),
Company Overview
Chipscale, Inc. is a technology company based in San Jose, California, specializing in advanced semiconductor solutions. The organization focuses on the development and manufacturing of innovative chip-scale packaging technologies that enhance the performance and efficiency of electronic devices. With a strong emphasis on research and development, Chipscale aims to address the evolving needs of industries such as telecommunications, consumer electronics, and automotive, contributing to the advancement of next-generation technologies.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 27 2026

14 Patents

#437 in San Jose, CA

#5,325 in California

#22,344 in US

#42,312 in the World

San Jose, CA (US)
San Jose, CA, United States of America

Chipscale, Inc.

Forward Citations = 332

7 inventors:

goldMedal Wendell B Sander (8 out of 109 patents)

silverMedal James L Young (7 out of 7 patents)

bronzeMedal Changsheng Chen (7 out of 7 patents)

4.  John G Richards (7 out of 17 patents)

5.  Phil P Marcoux (6 out of 8 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Chipscale, Inc.. Retrieved from https://idiyas.com/company/chipscale

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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