The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2005
Filed:
Feb. 20, 2004
Applicants:
Phil P. Marcoux, Mountain View, CA (US);
James L. Young, Mountain View, CA (US);
Changsheng Chen, Santa Clara, CA (US);
Inventors:
Phil P. Marcoux, Mountain View, CA (US);
James L. Young, Mountain View, CA (US);
Changsheng Chen, Santa Clara, CA (US);
Assignee:
ChipScale, Inc., San Jose, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L023/48 ; H01L023/52 ; H01L029/40 ; H01L023/29 ;
U.S. Cl.
CPC ...
Abstract
A method and apparatus for an electronic component package of a passive component using wafer level processing;is provided. Posts are formed on the active side of the substrate of an electronic component. A conductive layer leads the contact areas of the electronic component to the tops of the posts. The conductive layer on the top of the posts acting as leads, attaching to traces on a printed circuit board.