Chengdu Eswin Sip Technology Co., Ltd.

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USPTO Granted Patents = 4

Forward Citations = 9

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5 inventors (with patents filed for the assignee):

Xiaotian Zhou (4 out of 13 patents)

Minghao Shen (3 out of 11 patents)

Chunbin Zhang (2 out of 9 patents)

4. Yijiang Hu (1 out of 2 patents)

5. Shaolin Zou (1 out of 2 patents)

4 patents: Sort by Forward Citations

1. 11488931 - Encapsulated fan-in semiconductor package with heat spreader and method of manufacturing the same (2022-11-01),

2. 11274234 - Adhesive composition for temporary bonding of semiconductor workpiece and support carrier pair (2022-03-15),

3. 11177153 - Method of debonding work-carrier pair with thin devices (2021-11-16),

4. 10424524 - Multiple wafers fabrication technique on large carrier with warpage control stiffener (2019-09-24),

Company Overview

Chengdu Eswin Sip Technology Co., Ltd. is a leading provider of SIP communication solutions, offering a wide range of products and services to help businesses improve their communication efficiency. With a focus on research and development, Eswin Sip Technology is committed to delivering innovative solutions to meet the evolving needs of the market.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

4 Patents

#48 in Chengdu

#6,444 in China

Chengdu, China