Forward Citations = 5

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5 inventors (with patents filed for the assignee):

Xiaotian Zhou (4 out of 13 patents)

Minghao Shen (3 out of 11 patents)

Chunbin Zhang (2 out of 9 patents)

4. Yijiang Hu (1 out of 2 patents)

5. Shaolin Zou (1 out of 2 patents)

4 patents: Sort by Forward Citations

1. 11488931 - Encapsulated fan-in semiconductor package with heat spreader and method of manufacturing the same (2022-11-01),

2. 11274234 - Adhesive composition for temporary bonding of semiconductor workpiece and support carrier pair (2022-03-15),

3. 11177153 - Method of debonding work-carrier pair with thin devices (2021-11-16),

4. 10424524 - Multiple wafers fabrication technique on large carrier with warpage control stiffener (2019-09-24),

Chengdu Eswin Sip Technology Co., Ltd. is a leading provider of SIP communication solutions, offering a wide range of products and services to help businesses improve their communication efficiency. With a focus on research and development, Eswin Sip Technology is committed to delivering innovative solutions to meet the evolving needs of the market.

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USPTO Data Jan 1 1976 - Dec 2 2025

4 Patents

#49 in Chengdu

#5,522 in China

Chengdu, China

Chengdu Eswin Sip Technology Co., Ltd.